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100G BASE-LR4/OTU4 CFP Transceiver

100G BASE-LR4/OTU4 CFP Transceiver

MTRC-DG3CA CFP transceivers are designed for use in 100Gigabit Ethernet links and OTU4 over 10km single module fiber, and it compliant to the CFP MSA and IEEE 802.3ba 100GBASE-LR4. Digital diagnostics are available via MDIO as specified in the CFP MSA Man
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产品模块: 100G BASE-LR4/OTU4 CFP Transceiver
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Description

MTRC-DG3CA CFP transceivers are designed for use in 100Gigabit Ethernet links and OTU4 over 10km single module fiber, and it compliant to the CFP MSA and IEEE 802.3ba 100GBASE-LR4. Digital diagnostics are available via MDIO as specified in the CFP MSA Management Interface Specification.

The transceiver's designs are optimized for high performance and cost efficiency to provide customers the best solutions for Datacom and Telecom applications.

Features

lUp to10km transmission on SMF

lSupport Dual Rate 103.1G and 111.8Gbps

lTransmitter:4-lane*28Gb/s LAN-WDM EML TOSA(1295.56nm,1300.05nm,1304.58nm,1309.14nm)

lReceiver:4-lane*28Gb/s PIN ROSA

l10*10G Electrical Serial Interface (CAUI/OTL4.10)

lMDIO management interface with Digital Diagnostic

lCFP MSA package with duplex LC connector

+3.3V power supply

lPower consumption less than 12W lOperating case temperature: 0~+70°C

Applications

l100GE Routers and Switches

l100G DWDM/OTN

l100G Network Security

Compliance

lCompliant with IEEE 802.3ba 100GBASER-LR4 l

lCompliant with ITU-T 411-9D1F

lCompliant with CFP MSA Hardware Specification Rev1.4

lCompliant with CFP MSA MDIO Specification Rev1.4

Absolute Maximum Ratings

Parameter

Symbol

Conditions

Min.

Max.

Unit

Storage Temperature(Case)

TS

-40

+85

Relative Humidity

RH

5

+85

%

Damage Threshold for Receiver

Pmax

+10.0

dBm

Power Supply

Vcc

-0.3

+3.6

V

ESD Sensitivity on module and all host pins

HBM

Human Body model R=1.5K,

C=100pF

2000

V

Specification

Recommended Operating Conditions

Parameter

Symbol

Min.

Typical

Max.

Unit

Operating Case Temperature

Tc

0

+70

Supply voltage

Vcc 3.3V

+3.14

+3.3

+3.47

V

Supply Current

Icc 3.3V

3.3

A

Power dissipation

P

12

W

Low Power dissipation

PLow

2

W

In-rush Curent

I-inrush

50

mA/us

Turn-off rush Curent

I-turnoff

-50

mA/us

Link Distance

L

2M

10km

Transmitter Operating Characteristic-Optical (100GBASE-LR4)

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Channel data rate

25.7812

Gbps

Aggregate data rate

103.125

Gbps

Data rate variation

-100

+100

ppm

Lane Center Wavelength

λcT0

1294.53

1295.56

1296.59

nm

λcT1

1299.02

1300.05

1301.09

nm

λcT2

1303.54

1304.58

1305.63

nm

λcT3

1308.09

1309.14

1310.19

nm

Total Average Launch Power

Pout

10.5

dBm

Average Launch Power per

Lane

Peach

-4.3

4.5

dBm

Optical Modulation Amplitude per Lane

OMA

-1.3

4.5

dBm

Difference in Launch power

5.0

dB

between any two lances(OMA)

Launch power in OMA minus

TDP, per lane

Pomatdp

-2.3

dBm

Average Launch Power of

TX_DIS Transmitter per lane

Poff

TX_DIS=H

-30

dBm

Extinction Ratio

ER

4

5.5

dB

SMSR

SMSR

30

dB

Dispersion Penalty

DP

10km SMF

2.2

dB

Relative Intensity Noise

RIN

Mod off

-130

dB/Hz

Opitcal Return Loss Tolerance

TRL

20

dB

Transmitter reflectance

Tef

-12

dB

Optical Eye Mask {X1, X2, X3,

Y1, Y2, Y3}1

EMM

{0.25, 0.4, 0.45, 0.25, 0.28, 0.4}

Notes:

[1] Please refer to Figure 1

ReceiverOperating Characteristic-Optical (100GBASE-LR4)

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Channel data rate

25.7812

Gbps

Data rate variation

-100

+100

ppm

Lane Center Wavelength

λcT0

1294.53

1295.56

1296.59

nm

λcT1

1299.02

1300.05

1301.09

nm

λcT2

1303.54

1304.58

1305.63

nm

λcT3

1308.09

1309.14

1310.19

nm

Damage threshold

PDT

5.5

dBm

Figure 1. Transmission eye mask definition

Average receiver power per lane

Rpow

-10.6

4.5

dBm

Receive power OMA per Lane

Rovl

4.5

dBm

Difference in receive power between any two lanes(OMA)

5.5

dB

Receiver Sensitivity(OMA) per lane

Psen

-8.6

dBm

Stressed Receiver Sensitivity per Lane

Psen_str

-6.8

dBm

Receiver Reflectance

Ref

-26

dB

Conditions of stressed receiver sensitivity test

Vertical eye closure penalty per

Lane

1.8

dB

Stressed eye jitter per Lane

0.3

UI

Rx-Lane LOS Assert

-12

dBm

Rx-Lane LOS Deassert

-13.6

dBm

Rx-Lane LOS Hysteresis

0.5

dB

Transmitter Operating Characteristic-Optical (OTU4)

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Channel data rate

27.9525

Gbps

Aggregate data rate

111.809

Gbps

Data rate variation

-20

+20

ppm

Lane Center Wavelength

λcT0

1294.53

1295.56

1296.59

nm

λcT1

1299.02

1300.05

1301.09

nm

λcT2

1303.54

1304.58

1305.63

nm

λcT3

1308.09

1309.14

1310.19

nm

Total Average Launch Power

Pout

8.9

dBm

Average Launch Power per

Lane

Peach

-2.5

2.9

dBm

Optical Modulation Amplitude per Lane

OMA

-1.2

4.5

dBm

Difference in Launch power between any two lances(OMA)

5.0

dB

Average Launch Power of

TX_DIS Transmitter per lane

Poff

TX_DIS=H

-30

dBm

Extinction Ratio

ER

7

dB

SMSR

SMSR

30

dB

Relative Intensity Noise

RIN

Mod off

-130

dB/Hz

Opitcal Return Loss Tolerance

TRL

20

dB

Transmitter reflectance

Tef

-26

dB

Optical Eye Mask {X1, X2, X3,

Y1, Y2, Y3}1

EMM

NRZ 25G RATIO

{x1:0.25,x2:0.4,x3:0.45, y1:0.25,y2:0.28,y3:0.4

ReceiverOperating Characteristic-Optical (OTU4)

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Channel data rate

27.9525

Gbps

Data rate variation

-20

+20

ppm

Lane Center Wavelength

λcT0

1294.53

1295.56

1296.59

nm

λcT1

1299.02

1300.05

1301.09

nm

λcT2

1303.54

1304.58

1305.63

nm

λcT3

1308.09

1309.14

1310.19

nm

Damage threshold

PDT

5.5

dBm

Average receiver power per lane

Rpow

-8.8

2.9

dBm

Average total input power

8.9

dBm

Channel power difference

5.5

dB

Optical path penalty

1.5

dB

Receiver Sensitivity per lane2

Psen

-10.3

dBm

Receiver Reflectance

Ref

-26

dB

Rx-Lane LOS Assert

-13.6

dBm

Rx-Lane LOS Deassert

-12

dBm

Rx-Lane LOS Hysteresis

0.5

dB

Notes:

[1]Please refer to Figure 1

[2]OTU-4 Rate without FEC, BER < 10-12, ER > 7dB

Electrical High Speed I/O InterfaceCharacteristic-Transmitter(CAUI input interface)

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Signal Rate Per Lane

10.3125

Gb/s

Signal Rate Tolerance

-100

100

ppm

AC Common Mode input

Voltage Tolerance(RMS)

20

mV

Differential input return loss

Rldiff

IEEE

802.3ba-2010

See Equation (83B–7)

dB

Total Input Jitter Tolerance

Tjin

0.62

UI

Deterministic Input Jitter

Tdin

0.42

UI

Tolerance

Transmitter Input Eye Mask

(X1, X2)

(0.31, 0.5)

UI1

Transmitter Input Eye Mask

(Y1, Y2)

(42.5, 425)

mV1

Notes:

[1]Please refer to Figure 2

Figure 2.CAUI receiver eye mask

Electrical High Speed I/O InterfaceCharacteristic-Receiver(CAUI output interface)

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Signal Rate Per Lane

10.3125

Gb/s

Signal Rate Tolerance

-100

100

ppm

Single-ended output voltage

Vosig

-0.4

4

V

Output AC common-mode voltage(RMS)

VocomA

C

15

mV

Output transition time

Tr

20%~80%

24

ps

Differential output return loss

IEEE 802.3ba-2010

See Equation (83B–5)

dB

Total Jitter

Tj

0.4

UI

Deterministic Jitter

Tdj

0.25

UI

Receiver Output Eye Mask (X1,

X2)

(0.2, 0.5)

UI2

Receiver Output Eye Mask (Y1,

Y2)

(136, 380)

mV2

Notes:

[1]Please refer to Figure 3

Figure 3. CAUI transmitter eye mask

3.3V LVCMOSElectrical Low Speed I/O InterfaceCharacteristic

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Supply Voltage

Vcc

3.2

3.3

3.4

V

Input High Voltage

VIH

2

Vcc+0.3

V

Input Low Voltage

VIL

-0.3

0.8

V

Input Leakage Current

IIN

-10

+10

mA

Output High Voltage

(IOH =-100uA)

VOH

Vcc-0.2

Vcc+0.3

V

Output Low Voltage

(IOL =100uA)

VOL

-0.3

0.2

V

Minimum Pulse Width of

Control Pin Signal

t_CNTL

100

us

Notes.

(MOD_RSTn, MOD_LOPWR, TX_DIS, PRG_CNTL, MOD_ABS, RX_LOS, GLB_ALRMn, PRG_ALRM ) are

LVCMOS I/O interfaces.

1.2V LVCMOSElectrical Low Speed I/O InterfaceCharacteristic

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Input High Voltage

VIH

0.84

1.5

V

Input Low Voltage

VIL

-0.3

0.36

V

Input Leakage Current

IIN

-100

+100

uA

Output High Voltage

VOH

1.0

1.5

V

Output Low Voltage

VOL

-0.3

0.2

V

Output High Current

IOH

-4

mA

Output Low Current

IOL

+4

mA

Input capacitance

Ci

10

pF

Notes.

(MDIO, MDC, PRTADR4:0) are 1.2V LVCMOS I/O interfaces

Timing Parameters for CFP Hardware Signal Pins

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Hardware MOD_LOPWR

assert

t_MOD_LOPWR_assert

1

ms

Hardware MOD_LOPWR

deassert

t_MOD_LOPWR_deass ert

10

s

Receiver Loss of Signal Assert

Time

t_loss_assert

100

us

Receiver Loss of Signal

De-Assert Time

t_loss_deassert

100

us

Global Alarm Assert Delay Time

GLB_ALRMn_assert

150

ms

Global Alarm De-Assert Delay

Time

GLB_ALRMn_deassert

150

ms

Management Interface Clock

Period

t_prd

250

ns

Host MDIO t_setup

t_setup

10

ns

Host MDIO t_hold

t_hold

10

ns

CFP MDIO t_delay

t_delay

0

175

ns

Initialization time from Reset

t_initialize

2.5

s

Transmitter Disabled (TX_DIS asserted)

t_deassert

100

us

Transmitter Enabled

(TX_DIS de-asserted)

t_assert

2

ms

MDIO and MDC Timing Characteristics

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Management Interface Clock

Frequency

F_MDC

0.1

4

MHz

Management Interface Clock

Period

t_prd

250

10000

ns

Host MDIO t_setup

t_setup

10

ns

Host MDIO t_hold

t_hold

10

ns

CFP MDIO t_delay1

t_delay

0

175

ns

MDC high and low time

twidth

40

60

%

160

ns

MDIO/MDC termination in CFP

Zt

100

kOh

m

Notes.

[1] Delay from MDC rising edge to MDIO data change.

Figure 4. MDIO & MDC Timing Diagram

Reference Clock Characteristics

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Impedance

Zd

80

100

120

ohm

Frequency

1/64 of host lane rate

Frequency Stability

Xf

-100

+100

ppm1

-20

+20

ppm2

Input Differential Voltage

Vdiff

400

1200

mV3

RMS Jitter

σ

10

ps4

Clock Duty Cycle

40

60

%

Clock Rise/Fall Time 10/90%

Tr/f

200

1250

ps5

Notes.

[1]For Ethernet applications

[2]For Telecom applications

[3]Peak to Peak Differential

[4]Random Jitter. Over frequency band of 10kHz < f < 10MHz

[5]1/64 of electrical lane

Transmitter & Receiver Monitor Clock Characteristi

cs

Parameter

Symbol

Condition

Min.

Typical

Max.

Unit

Impedance

Zd

80

100

120

ohm

Frequency

1/8 of network lane rate

Ouput Differential Voltage

Vdiff

400

1200

mV1

Clock Duty Cycle

40

60

%

Notes.

[1] Peak to Peak Differential

Pin-out Definition

Figure 5. CFP Module Pad Layout

Figure 6. CFP Module Pin Map

Notes.

[1]Pin 21,22,27,28,29,50,51,53,54 are internally used and NOT allowed to connect any signal and power.

[2]Pin 24,25,76,77 are disabled unless MCLK output is enabled via MDIO.

Pin definition

PIN

Name

I/O

Logic

Description

1

3.3V_GND

3.3V Module Supply Voltage Return Ground, can be

separate or tied together with Signal Ground

2

3.3V_GND

3

3.3V_GND

4

3.3V_GND

5

3.3V_GND

6

3.3V

3.3V Module Supply Voltage

7

3.3V

8

3.3V

9

3.3V

10

3.3V

11

3.3V

12

3.3V

13

3.3V

14

3.3V

15

3.3V

16

3.3V_GND

3.3V Module Supply Voltage Return Ground, can be

separate or tied together with Signal Ground

17

3.3V_GND

18

3.3V_GND

19

3.3V_GND

20

3.3V_GND

21

VND_IO_A

I/O

Module Vendor I/O. Must No Connect at host board

22

VND_IO_B

I/O

Module Vendor I/O. Must No Connect at host board

23

GND

24

TX_MCLKn

O

CML

TX Monitor Clock Output (Negative)

25

TX_MCLKp

O

CML

TX Monitor Clock Output (Positive)

26

GND

27

VND_IO_C

I/O

Module Vendor I/O. Must No Connect at host board

28

VND_IO_D

I/O

Module Vendor I/O. Must No Connect at host board

29

VND_IO_E

I/O

Module Vendor I/O. Must No Connect at host board

30

PRG_CNTL1

I

LVCMOS w/ PUR

Programmable Control 1 set over MDIO, MSA Default: TRXIC_RSTn, TX & RX ICs reset, "0": reset, "1" or NC:

enabled = not used

4.75kohm pull up in the module

31

PRG_CNTL2

I

LVCMOS w/ PUR

Programmable Control 2 set over MDIO, MSA Default:

Hardware Interlock LSB, "00": ≤8W, "01":≤16W, "10": ≤24W,

"11" or NC: ≤32W = not used

4.75kohm pull up in the module

32

PRG_CNTL3

I

LVCMOS w/ PUR

Programmable Control 3 set over MDIO, MSA Default:

Hardware Interlock MSB, "00": ≤8W, "01": ≤16W, "10":

≤24W, "11" or NC: ≤32W = not used

4.75kohm pull up in the module

33

PRG_ALRM1

O

LVCMOS

Programmable Alarm 1 set over MDIO, MSA Default: HIPWR_ON, "1": module power up completed, "0": module not high powered up

34

PRG_ALRM2

O

LVCMOS

Programmable Alarm 2 set over MDIO, MSA Default: MOD_READY, "1": Ready, "0": not Ready.

35

PRG_ALRM3

O

LVCMOS

Programmable Alarm 3 set over MDIO, MSA Default:

MOD_FAULT, fault detected, "1": Fault, "0": No Fault

36

TX_DIS

I

LVCMOS w/ PUR

Transmitter Disable for all lanes, "1" or NC = transmitter disabled, "0" = transmitter enabled

37

MOD_LOPWR

I

LVCMOS w/ PUR

Module Low Power Mode. "1" or NC: module in low power

(safe) mode, "0": power-on enabled

4.75kohm pull up in the module

38

MOD_ABS

O

GND

Module Absent. "1" or NC: module absent, "0": module present, Pull Up Resistor on Host

39

MOD_RSTn

I

LVCMOS w/ PDR

Module Reset. "0" resets the module, "1" or NC = module enabled, 4.75kohm Pull Down Resistor in Module

40

RX_LOS

O

LVCMOS

Receiver Loss of Optical Signal, "1": low optical signal, "0":

normal condition

41

GLB_ALRMn

O

LVCMOS

Global Alarm. “0": alarm condition in any MDIO Alarm register, "1": no alarm condition, Open Drain, Pull Up Resistor on Host

42

PRTADR4

I

1.2V CMOS

MDIO Physical Port address bit 4

43

PRTADR3

I

1.2V CMOS

MDIO Physical Port address bit 3

44

PRTADR2

I

1.2V CMOS

MDIO Physical Port address bit 2

45

PRTADR1

I

1.2V CMOS

MDIO Physical Port address bit 1

46

PRTADR0

I

1.2V CMOS

MDIO Physical Port address bit 0

47

MDIO

I/O

1.2V CMOS

Management Data I/O bi-directional data (electrical specs as per 802.3ae and ba)

48

MDC

I

1.2V CMOS

Management Data Clock (electrical specs as per 802.3ae and ba)

49

GND

50

VND_IO_F

I/O

Module Vendor I/O. Must No Connect at host board

51

VND_IO_G

I/O

Module Vendor I/O. Must No Connect at host board

52

GND

53

VND_IO_H

I/O

Module Vendor I/O. Must No Connect at host board

54

VND_IO_J

I/O

Module Vendor I/O. Must No Connect at host board

55

3.3V_GND

3.3V Module Supply Voltage Return Ground, can be separate or tied together with Signal Ground

56

3.3V_GND

57

3.3V_GND

58

3.3V_GND

59

3.3V_GND

60

3.3V

3.3V Module Supply Voltage

61

3.3V

62

3.3V

63

3.3V

64

3.3V

65

3.3V

66

3.3V

67

3.3V

68

3.3V

69

3.3V

70

3.3V_GND

3.3V Module Supply Voltage Return Ground, can be

separate or tied together with Signal Ground

70

3.3V_GND

71

3.3V_GND

72

3.3V_GND

73

3.3V_GND

74

3.3V_GND

PIN

Name

I/O

Logic

Description

75

GND

76

RX_MCLKp

O

RX Monitor Clock Output (Positive)

77

RX_MCLKn

O

RX Monitor Clock Output (Negative)

78

GND

79

RX0p

O

HS I/O

Lane 0 Receiver Output (Positive)

80

RX0n

O

HS I/O

Lane 0 Receiver Output (Negative)

81

GND

82

RX1p

O

HS I/O

Lane 1 Receiver Output (Positive)

83

RX1n

O

HS I/O

Lane 1 Receiver Output (Negative)

84

GND

85

RX2p

O

HS I/O

Lane 2 Receiver Output (Positive)

86

RX2n

O

HS I/O

Lane 2 Receiver Output (Negative)

87

GND

88

RX3p

O

HS I/O

Lane 3 Receiver Output (Positive)

90

GND

91

RX4p

O

HS I/O

Lane 4 Receiver Output (Positive)

92

RX4n

O

HS I/O

Lane 4 Receiver Output (Negative)

93

GND

94

RX5p

O

HS I/O

Lane 5 Receiver Output (Positive)

95

RX5n

O

HS I/O

Lane 5 Receiver Output (Negative)

96

GND

97

RX6p

O

HS I/O

Lane 6 Receiver Output (Positive)

98

RX6n

O

HS I/O

Lane 6 Receiver Output (Negative)

99

GND

100

RX7p

O

HS I/O

Lane 7 Receiver Output (Positive)

101

RX7n

O

HS I/O

Lane 7 Receiver Output (Negative)

102

GND

103

RX8p

O

HS I/O

Lane 8 Receiver Output (Positive)

104

RX8n

O

HS I/O

Lane 8 Receiver Output (Negative)

105

GND

106

RX9p

O

HS I/O

Lane 9 Receiver Output (Positive)

107

RX9n

O

HS I/O

Lane 9 Receiver Output (Negative)

108

GND

109

NC

Not Connected Internally

110

NC

Not Connected Internally

111

GND

112

GND

113

TX0p

I

HS I/O

Lane 0 Transmitter Input (Positive)

114

TX0n

I

HS I/O

Lane 0 Transmitter Input (Negative)

115

GND

116

TX1p

I

HS I/O

Lane 1 Transmitter Input (Positive)

117

TX1n

I

HS I/O

Lane 1 Transmitter Input (Negative)

118

GND

119

TX2p

I

HS I/O

Lane 2 Transmitter Input (Positive)

120

TX2n

I

HS I/O

Lane 2 Transmitter Input (Negative)

121

GND

122

TX3p

I

HS I/O

Lane 3 Transmitter Input (Positive)

123

TX3n

I

HS I/O

Lane 3 Transmitter Input (Negative)

124

GND

125

TX4p

I

HS I/O

Lane 4 Transmitter Input (Positive)

126

TX4n

I

HS I/O

Lane 4 Transmitter Input (Negative)

127

GND

128

TX5p

I

HS I/O

Lane 5 Transmitter Input (Positive)

129

TX5n

I

HS I/O

Lane 5 Transmitter Input (Negative)

130

GND

131

TX6p

I

HS I/O

Lane 6 Transmitter Input (Positive)

132

TX6n

I

HS I/O

Lane 6 Transmitter Input (Negative)

133

GND

134

TX7p

I

HS I/O

Lane 7 Transmitter Input (Positive)

135

TX7n

I

HS I/O

Lane 7 Transmitter Input (Negative)

136

GND

137

TX8p

I

HS I/O

Lane 8 Transmitter Input (Positive)

138

TX8n

I

HS I/O

Lane 8 Transmitter Input (Negative)

139

GND

140

TX9p

I

HS I/O

Lane 9 Transmitter Input (Positive)

141

TX9n

I

HS I/O

Lane 9 Transmitter Input (Negative)

142

GND

143

NC

Not Connected Internally

144

NC

Not Connected Internally

145

GND

146

REFCLKp

I

Reference Clock Input (Positive)

147

REFCLKn

I

Reference Clock Input (Negative)

148

GND

Dimensions

100Gb/s CFP mechanical dimensions should be compliant with CFP MSA specification. Detailed dimensions are shown in Figure 7.

Uint:mm

The mechanical dimensions of the electrical connectors on the CFP Host PCB are shown in Figure 8.

Figure 8

CFP Mechanical Char

acteristics

Max.

Unit

Notes

Weight

350

g

Flatness

0.15

mm

Roughness

6.3

Ra

Dimensions

CFP transceivers supports the MDIO interface specified in IEEE802.3 Clause 45. This 2-wire management data I/O interface is provided for the module status monitoring and control. The management data clock (MDC) provides clocking for the data that is passed on the MDIO port. Five further pins allow for loading of a port address (PORT_ADDR0-4) into the module.

Notes: Capacitor represents stray capacity 600ohm pull-up is preferred

For more detailed information please refer to "CFP MSA Management Interface Specification Version 2.2 r06".

Ordering Information

Part No.

Specification

Pack

Rate

Tx

Rx

Reach

Connetor

MTRC-DG3CA

CFP

103.1G

111.8G

4*28G LAN-WDM EML TOSA

4*28G PIN ROSA

10km

LC

Contact Information

Wuhan Huagong Genuine Optics Technology Co., Ltd

Address: Science & Technology Region of HUST, Donghu High-Tech Zone

Wuhan, Hubei Province, 430223, China

l Tel: +86-27-87180102

lFax: +86-27-87180220

Statement

HG Genuine possesses the authority for ultimate explanation of all information contained in this document, which is subject to change without prior notice. All the information was obtained in specific environments; and HG Genuine will not be responsible for verifying the products performance in customers’ operating environments, neither liable for the performance of users' products. All information contained is only for the users' reference and shall not be considered as warranted characteristics. HG Genuine will not be liable for damages arising directly or indirectly from any use of the information contained in this document.

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